Features
For surface mounted applications in order to optimize board space
Low leakage
Uni and Bidirectional unit
Glass passivated junction
Low inductance
Excellent clamping capability
400W Peak power capability at 10 × 1000µs waveform Repetition rate
(duty cycle):0.01%
Fast response time: typically less than 1.0ps from 0 Volts to VBR min
Typical IR less than 5μA above 12V
High Temperature soldering: 260°C/40 seconds at terminals
Typical maximum temperature coefficient ΔVBR = 0.1% × VBR@25°C× ΔT
Plastic package has Underwriters Laboratory Flammability 94V-0
Matte tin lead–free Plated
Halogen free and RoHS compliant
Typical failure mode is short from over-specified voltage or current
Whisker test is conducted based on JEDEC JESD201A per its table
4a and 4c
Scan to follow
Scan to follow